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Home AI Qualcomm Investor Day 2026 Data Center Announcements CPUs, AI Accelerators, and More
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Qualcomm Investor Day 2026 Cover Large
I am here in New York City for Qualcomm Investor Day 2026 (thanks to Qualcomm for covering my travel). This is the event Qualcomm has been talking about as its venue for re-launching its data center offerings. Earlier today, with the OpenAI Jalapeño Intelligence Platform Shown Powered by Broadcom piece, we noted that Qualcomm announced a big acquisition of Modular today to help bolster its AI story. The company is going to go into more than just the datacenter, but that is what I wanted to focus on today.
Patrick At Qualcomm Investor Day 2026 Large<br>Also, I am typing this live, so please excuse typos.
Qualcomm Investor Day 2026 Datacenter Announcements
Christiano Amon, Qualcomm’s CEO is up first.
Qualcomm Investor Day 2026 Christiano Large<br>In the three dimensions to Qualcomm’s future, number one is rack-scale data center infrastructure.
Qualcomm Investor Day 2026 Three Dimensions To Qualcomm’s Future Large<br>Christiano has a slide on the scale of Qualcomm’s IP.
Qualcomm Investor Day 2026 Technology And IP Large<br>Here is a slide on just how Qualcomm consumes over 1M leading-edge wafers, and has a lot of technology.
Qualcomm Investor Day 2026 Qualcomm Scale Large<br>Next up is Tony Pialis, Qualcomm’s head of data center.
Qualcomm Investor Day 2026 Tony Pialis Large<br>The agentic AI era requires new compute infrastructure.
Qualcomm Investor Day 2026 Scale Of Compute Large<br>Qualcomm is saying that agentic AI will reshape infrastructure.
Qualcomm Investor Day 2026 Agentic Era Reshapes Infrastructure Large<br>The company is now qualified on its connectivity solutions from Alphawave. Next will be custom silicon. Then a new AI accelerator. There is also a new CPU on the roadmap for agentic AI.
Qualcomm Investor Day 2026 DC Roadmap Large<br>Setting up the challenge, performance is constrained by memory footprints as models get much larger. This makes sense as we often see AI inference performance and capabilities limited by memory capacity and memory bandwidth.
Qualcomm Investor Day 2026 Memory Wall Large<br>This is one of the huge innovations. High Bandwidth Compute (HBC). Instead of HBM over CoWoS interposer, Qualcomm is saying that it will stack memory on top of compute tiles. Details are a bit light, but it seems like 768GB or so of LPDDR memory and a base die with compute that operates as an accelerator. It also sounds like there are going to be different versions of this for other markets such as smaller versions that can go into maybe automotive or client devices.
Qualcomm Investor Day 2026 High Bandwidth Compute HBC Large<br>Qualcomm says HBC is the best performance per watt because it saves power from having to move across an interposer to HBM. The idea is that this will compete with HBM in capacity and SRAM performance because it is closer to the CPU or accelerator.
Qualcomm Investor Day 2026 HBC Eliminates The HBMC Tax Without SRAM Large<br>Qualcomm has a message from Satya Nadella, who is talking about...